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Giga Scale IC's Vin Ratford to Moderate Panel on Semiconductor Intellectual Property During Semiconductor Venture Fair III
FSA-Hosted Event Will Identify Challenges, Opportunities of
Growing Segment
CUPERTINO, Calif.—(BUSINESS WIRE)—May 10, 2004—
Vin Ratford, president of Giga Scale Integration Corporation (Giga
Scale IC(TM)), will moderate a panel titled, "Challenges and
Opportunities in Semiconductor intellectual property (IP)," during
Semiconductor Venture Fair III. The session, hosted by the Fabless
Semiconductor Association (FSA) IP Committee, will be held Wednesday,
May 12, from 8:15-9:45 a.m. at the Wyndham San Jose Hotel on North
First Street in San Jose, Calif.
The panel of semiconductor industry experts will examine the IP
business that has grown throughout the recent downturn to almost $1
billion in yearly sales. Panelists will discuss whether this growth
can be sustained and winners and losers going forward. They will
attempt to answer whether IP quality will improve to allow for more
outsourcing, what business models are likely to succeed, and how to
respond to technical and economic challenges of 90 nm design.
Panelists are: Liam Goudge, director of worldwide business
development at ARM Ltd.; Mark Templeton, president and chief executive
officer (CEO) of Artisan Components; Aurangzeb Khan, corporate vice
president of business development and chief technology officer of
worldwide field operations at Cadence Design Systems; Lucio Lanza,
managing partner of Lanza Tech Ventures; Rich Wawrzyniak, senior
analyst application specific integrated circuit (ASIC) and system on
chip (SoC) at Semico Research Corp.; and Kurt Wolf, director of the
Library Management Division of TSMC.
Semiconductor Venture Fair III will take place May 11-12. It
brings together private equity investors, executives of leading
semiconductor companies, and entrepreneurs from emerging
semiconductor-related companies to explore significant investment
opportunities in today's semiconductor sector. More details can be
found at: http://www.semiconductorventurefair.com.
About Giga Scale IC
Founded in 2003, Giga Scale Integration Corporation -- or Giga
Scale IC(TM) -- is a private Electronic Design Automation (EDA)
software company that develops InCyte(R), the first Specification
Optimization System for integrated circuit (IC) design. Used during
the Specify and Create phases of design, InCyte generates a Silicon
Virtual Model(TM) (SVM) containing power, leakage, speed, die size,
yield and cost for different processes. InCyte includes a
specification cockpit, floorplanner and estimator bundled with
semiconductor intellectual property (IP) to create the SVM. The SVM
interfaces with other EDA tools and is used across the semiconductor
supply chain to ensure compliance with the specification. Giga Scale
IC corporate headquarters are located at: 10050 North Wolfe Road,
Suite SW1-266, Cupertino, Calif. 95014. Telephone: (408) 255-0444.
Facsimile: (408) 255-0344. Email: info@gigaic.com. Web Site:
http://www.gigaic.com.
InCyte, InCyte-Specify, InCyte-Create and Time Architect are
registered trademarks of Giga Scale Integration Corporation. Giga
Scale IC, First Tool in the Design Chain and Silicon Virtual Model are
trademarks of Giga Scale Integration Corporation. Giga Scale IC
acknowledges trademarks or registered trademarks of other
organizations for their respective products and services.
Contact:
Public Relations for Giga Scale IC
Nanette Collins, 617-437-1822
nanette@nvc.com
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